Background introduction
SIP (system-in-package) is no longer a new thing in the market. Compared with electronic products in the 1970s, modern electronic products such as mobile phones and home appliances use innovative semiconductors, which are not only small in size but also versatile. However, for semiconductor manufacturers, it is always a challenge to achieve smaller, more versatile, reliable, economical and shorter time to market for electronic products.
In order to get smaller electronic products, you must use a compact Printed Circuit Board design! In other words, due to the larger package size on the small printed Circuit Board, the mounting space on the board is very limited. In addition, it is also important to have more features built into smaller electronic products and to reduce time to market. In automotive applications, most printed circuit boards have been designed and used for many years. Due to the introduction of more and more special or safety functions in automotive applications, it is very difficult to redesign frequently according to market requirements for new packages or different package sizes. For these many limitations and requirements, "QFN package with compact SIP" solves all problems.
design concept
Figure 1 shows the passive components installed in the DrMOS package. Passive components can be installed between the pins due to the electrical wiring/pin location and application. Figure 2 shows an inductor that cannot be installed in a DrMOS package. The main reason why it cannot be installed is that it generates a large amount of heat during operation, and the thickness of the inductor element and the mounting space of the DrMOS also have an effect.
Figure 1 Passive components installed in the DrMOS package
Figure 2 Inductors that cannot be installed in a DrMOS package
The "QFN package with compact SIP" concept uses a pre-formed package with a dedicated pin count. Power products, logic products, passive components, resistors, etc. can be integrated/mounted on the top and bottom surfaces of the preformed package. Figure 3 shows the new packaging concept of “QFN package with compact SIPâ€.
Figure 3: The new packaging concept of "QFN package with compact SIP"
AC Power Adapter,Power Adapter,USB Power Adapter,Electrical Power Adapters
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