Molex , the world's leading provider of complete interconnect products, introduces a new modular NeoScaleTM parallel-panel interconnect system that delivers optimal signal integrity at 28+ Gbps data rates. NeoScale is designed for printed circuit board (PCB) parallel board applications for enterprise network towers and telecommunications switches and servers, as well as industrial controllers and medical and military high data rate scanning equipment. The NeoScale Parallel Board Interconnect System features a patent-pending triad wafer structure that isolates each differential pair for optimal performance and customization.
Adam Stanczak, Molex's new product development manager, explains: "Each differential pair of modular NeoScale triple layout consists of three pins - two signal pins and one shield ground pin. Each triple layout is a separate 28 Gbps differential pair. Eliminates the need for additional grounding pins and can be optimized for high-speed single-ended or power systems. The highly flexible and powerful NeoScale parallel-panel interconnect system provides a very clean interface compared to other similar connectors on the market for today's parallel-panel connectors. Signal transmission and signal integrity."
The NeoScale Parallel Board Interconnect System's cellular structure is wired for each triple-layer layout to minimize crosstalk and achieve efficient PCB routing in one or two layers, essentially saving PCB material costs. In addition, the unique tombstone structure inside the connector housing protects the mating interface and flexible contacts to help prevent damage to the terminals. The NeoScale layout has a density of 82 differential pairs per square inch and can be customized to support high speed differential pairs, high speed single-ended transmissions, low speed single-ended signals and power contacts. The NeoScale is available in 85 and 100 ohm impedance and 12 to 40mm mating stack heights. Design options include 6 to 30 circuit columns, available in 2, 4, 6 and 8 row options, and one component with 12 to 240 triple layouts.
The NeoScale Parallel Board Interconnect System uses Molex's patented Solder Charge TechnologyTM technology as a PCB termination. Compared to ball grid array connector mounting, the mechanical SMT process is more cost effective and reliable, simplifies design and facilitates a robust solder joint in mass production, eliminating the need for hot mounting and complex forms of soldering leadframes. (solder tail).
The NeoScale plug assembly has a differential pair spacing of 2.80mm. The socket assembly pins contain directional and keying features. The ground pin has two SMT attachment points, and each set of triple layout has four solder charge connections, so the PCB footprint does not change when mixing and matching different differential pairs, high speed single-ended and power triple layouts in the housing. NeoScale plug and socket orientation guides provide mirrored structure and back-to-back protection boundaries. The resulting mirror line splits the triple layout pair to help with PCB layout and RX/TX pin output management for optimum signal integrity and mechanical stability. The durable molded structure further protects the connector from handling damage and provides optimized signal integrity and mechanical stability.
Stanczak added: "The modular NeoScale Parallel Board Interconnect System is the ideal solution for space-constrained designs and limited PCB space, providing system architects and designers with durable and easy-to-customize design tools for a large number of High density system applications."
The pin refers to the connection between the internal circuit of the integrated circuit (chip) and the peripheral circuit, and the pin constitutes the interface of the chip. According to the function, the pins of AT89S52 can be divided into four categories: main power supply, external crystal oscillator or oscillator, multi-function I/O port, and control, strobe and reset.
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