With the trend of thin and light smartphone products, the size of the speakers is becoming more and more limited, which makes it difficult to improve the performance of the external speakers. At the same time, audio is now a very important selling point on mobile phones. High volume and good sound quality are very mainstream requirements on the market. So in the face of these two aspects of Tradeoff, SmartPA is in the market more and more demand.
SmartPA mainly protects the speaker amplitude and speaker temperature through intelligent protection algorithms, so as to fully utilize the potential of the speaker, and achieve high volume and good sound quality with limited speaker space. This part of TI's solutions mainly includes TAS2557, TAS2560 and TAS2559. For the mono solution, it is mainly the TAS2557 with built-in DSP and the TAS2560 without DSP. For the built-in DSP solution, the protection algorithm runs on the DSP inside the chip, so the implementation is relatively easy. For the solution without DSP, the protection algorithm needs to run on the platform side of the DSP, then this article is mainly for this application, how to use the TAS2560 on the Qualcomm platform.
The first step is mainly to confirm the actual needs of the project, mainly including the following:
Is the project mono or stereo?
What is the number of I2S? What is the specific format?
What is the maximum sampling rate? It is usually 48K or 44.1K.
Confirm the storage location of the algorithm related parameters, is it directly using bin file or Qualcomm default acdb file?
For use with SmartPA, do you need several usage scenarios?
Factory Verification Requirements: Is there a standard test procedure and test source? Are there any other requirements besides Re calibration?
The second step is mainly the integration of the TAS2560 driver. This part of TI provides standard reference code, which is relatively easy to implement. The goal is to achieve the normal sound of Speaker. At this stage, you can directly test some electrical characteristics, such as THD+N, noise floor, etc. to confirm whether the audio channel is normal. The following points need to be noted:
Confirm the format of the platform output I2S signal, preferably re-confirmed by the oscilloscope.
Note the setting of the PLL on the TAS2560 side. If there is a noise problem, it is recommended to first confirm that the PLL is correct.
Inside the driver you need to know the range of the DC impedance of the speaker.
The third step is the porting of the algorithm on the Qualcomm platform. The main work, as shown in the following figure, is to integrate our intelligent power amplifier algorithm library and corresponding framework into the ADSP end of Qualcomm platform. Generally, ADSP is directly integrated in Within the main platform. The detailed steps are as follows:
The TX port of the I2S is enabled on the platform side, and the TX path refers to the path fed back from the TAS2560 to the platform.
Confirm that the feedback IV signal is correct.
DSP side and AP side related code implementation, this part is also related reference code for reference.
PPC3 is installed and the communication between PPC3 and mobile phone side is normal. PPC3 is a professional graphical interface tool provided by TI. The specific interface is as follows.
The implementation of the factory check code, pay special attention to the need to close the algorithm on the audio path when doing the check.
Algorithm verification, this part of TI will also provide a standard verification process.
The fourth step is modeling and tuning. This part mainly includes the following steps:
Specific parameters and related specifications for the speakers Xmax, Tmax, Tcoef, BL and Sd are provided.
Prepare the apertured horn and model it with PPC3.
The tuning engineer made a rough adjustment.
After the whole machine and the horn are confirmed, further modeling and fine adjustment are made on the basis of the whole machine.
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