From November 14th to 17th, the “2016 World Telecommunication Exhibition†hosted by the International Telecommunication Union ITU was held at the IMPACT Exhibition Center in Bangkok, Thailand. As a member of the “China National Pavilionâ€, China Mobile participated in this conference to promote the development of ICT innovation. The theme of “Promoting the Transformation of Life Production Mode†focuses on the display of China's leading TD-LTE technology and 5G, terminal and cloud video technologies.
On the booth, China Mobile systematically demonstrated the latest development of TD-LTE development: TD-LTE continues to expand its commercial scale in the world. As of the third quarter of 2016, 46 countries around the world have opened 85 TD-LTE commercials. The network, in another 60 countries, 97 TD-LTE commercial networks are being planned for deployment, and the global users of TD-LTE exceed 800 million. With the help of the world's largest TD-LTE network, China Mobile will actively promote the global division of TDD spectrum, and use innovative products such as Mangebao and large-scale antennas to strengthen the network's wide, deep and thick coverage, and continuously deepen the 4G boutique network and its Subsequent evolution. At the same time, the carrier aggregation high-rate data service and the VoLTE commercial high-definition voice service experience are continuously improved, creating a continuous and smooth mobile communication network for customers and enjoying a variety of new services.
In the 5G exhibition area, many viewers were attracted to watch. It is understood that in February 2016, during the World Mobile Communications Conference in Barcelona, ​​China Mobile joined forces with the first 11 partners to officially launch the China Mobile 5G Joint Innovation Center. After 9 months of promotion, it now has 51 partners in six areas of basic communication, Internet of Things, Internet of Vehicles, Virtual Reality/Augmented Reality, Cloud Intelligent Robot and Industrial Internet. It has built the first batch of 4 open laboratories and joint communication. Enterprises, Internet companies and vertical application industry partners have promoted the development of 5G innovative applications and the construction of cross-industry integration ecosystems.
At the exhibition, China Mobile also exhibited 5 new 4G terminals, including the latest 4G terminal A2 supporting CA (Carrier Aggregation) features, and integrated RCS (integrated communication) terminal N2 independently developed by China Mobile. The latest high cost performance of China Mobile Terminal A1s, a variety of terminals produced by China Mobile and foreign operators, and an information product for government and enterprise customers - Cloud Video. The cloud video products include two conference terminals independently developed by China Mobile, namely the low-cost HD conference terminal C21 and the intelligent projection conference terminal C15, which vividly present the latest achievements of China Mobile in the video conference market.
During the exhibition, China Mobile will also organize the “6th TD-LTE Technology and Spectrum Seminar†jointly with ITU, GTI and TD Industry Alliance to jointly promote the commercialization of TDD scale, promote the global division of spectrum and improve the utilization of spectrum resources. To take advantage of TDD technology and promote the development of 5G.
Usually,10 & 20 layers PCB are HDI board,but some are not .Some with big trace width and space,holes are over 0.3mm too. We have much experience in doing 10 layer PCB & 20 layer PCB.
A ten-layer board should be used when six routing layers are required. Ten-layer boards, therefore, usually have six signal layers and four planes. Having more than six signal layers on a ten-layer board is not recommended. Ten-layers is also the largest number of layers that can usually be conveniently fabricated in a 0.062" thick board. Occasionally you will see a twelve-layer board fabricated as a 0.062" thick board, but the number of fabricators capable of producing it are limited..
High layer count boards (ten +) require thin dielectrics (typically 0.006" or less on a 0.062" thick board) and therefore they automatically have tight coupling between layers. When properly stacked and routed they can meet all of our objectives and will have excellent EMC performance and signal integrity.
A very common and nearly ideal stack-up for a ten-layer board is shown in Figure 12. The reason that this stack-up has such good performance is the tight coupling of the signal and return planes, the shielding of the high-speed signal layers, the existence of multiple ground planes, as well as a tightly coupled power/ground plane pair in the center of the board. High-speed signals normally would be routed on the signal layers buried between planes (layers 3-4 and 7-8 in this case).
10 layer PCB 10 layer TG170 PCB 10 layer design
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