Recently, Hangzhou Kaiding Technology and China Electric Power Research Institute of Communications and Power Technology Branch officially signed a contract for 'cooperative development of OLT-based ONU chips based on PON's electro-optic communications. Kaiding Technology will exclusively provide the national smart grid construction. Optoelectronic communications dedicated chip and related solutions. This means that the national smart grid communication technology not only has a 'China Core', but also means that the National Grid Corporation's smart chip industrialization base communications chip project is fully launched.
As the first and the fourth IC design company in the world to master EPON core communication chip technology, it is an original technology enterprise that is dedicated to the development and design of optical access network chips. In 2010, the company took the lead in China to master EPON chip R&D technology with completely independent intellectual property rights.
The China Electric Power Research Institute is the maker of a series of standards for China's smart grid, and possesses the key technologies of the smart grid. It plays a crucial role in China's national smart grid projects. At the same time, the Communication and Power Consumption Branch of the Institute of Electrical Engineering and Technology is the national power grid chip industrial base and has undertaken the research and development and application of key chip technologies of the State Grid Corporation of China.
Since 2010, Kaiding Science and Technology and China Electric Power Research Institute have jointly launched a major issue of China's smart grid "EPON chip applied to distribution automation", participated in the State Grid Corporation of Standard "Ethernet-based passive optical network ( EPON)'s revision and a series of cooperation.
In January 2011, Kaiding Technology and the China Electric Power Research Institute of Communications and Power Technology Branch formally signed a contract. The two parties will formulate a power communication environment based on the relevant technical requirements of the State Grid Corporation's power consumption information collection system and distribution network automation system. Strong protection, high security, low power consumption, small size chip complete solution.
'Kaiding Technology has mastered a variety of integrated circuit design core technologies and has extensive IC product design and development experience. The responsible person of the China Electric Power Research Institute commented.
It is understood that the construction of the smart grid will be implemented in three phases: the first phase will be 2009-2010, mainly research and pilot; the second phase will be 2011-2015 and will be implemented on a large scale; the third phase will be 2016 - In 2020, the overall improvement and improvement will be achieved.
From the progress of the cooperation between Kaiding Science and Technology and the Institute of Electric Power, we can see that Kaiding Science and Technology, as it is the first of its kind in the country, has not only caught up with the 'first phase' in time. It has also entered the 'second stage' substantively. Li Yue, director of Kaiding Technology Products, said this.
It is understood that by 2020, the smart grid construction will achieve at least 4 trillion yuan in investment, among which the demand for communication chips will reach tens of billions of yuan.
In July 2010, Liu Zhenya, general manager of the State Grid Corporation of China, proposed the 'four network convergence' strategy at the 'Smart Grid International Forum' and join the existing three networks (telecommunications network, computer network and cable television network). The horn of the power grid and power system entering the communications industry officially blew.
From the point of view of four-network convergence, the status of communications technology in smart grid construction will be further enhanced, which means that the market share of communications chips will also be greatly expanded! Li Yue, Director of Kaiding Technology, said.
Li Yue believes that China's IC design has a short history and a weak foundation, as seen from an industrial perspective. The squeezing of foreign giants, the influence of self-owned brands, and the inertia of the market and users' reliance on imported chips have challenged the industry's next-step development. However, the introduction of a series of policies by various levels of government, and the increasing efforts of local governments in nurturing new industries and promoting changes in economic growth patterns, provide a more favorable policy environment for the IC design industry.
It is reported that in 2010 China's IC design industry was approximately US$5.5 billion, an increase of 34.8% year-on-year, exceeding the growth rate of 29.8% in the Chinese IC industry. It is expected that by 2013, the IC design industry will exceed US$11.2 billion. Among them, the independent intellectual property rights in the field of large-scale integrated circuits are relatively weak. Therefore, Kaiding's EPON core chips can be widely used in large-scale ICs such as smart grids, triple-play networks, optical network cities, wireless cities, and safe cities. Intellectual property technology has a very broad prospect.
At present, Kaiding Technology has been listed in Hangzhou's Eagle Project and is recognized as a high-tech enterprise in Hangzhou. In view of the characteristics of large input and long cycle of IC design, related departments and Hangzhou Science and Technology Bank successively provided financial support for Kaiding Science and Technology in various ways. The world-famous integrated circuit companies TSMC, UMC and Kawasaki visited the company on several occasions and became important partners for Kaiding Technology. Qian Yuebao, the deputy chairman of the National People's Congress and the chairman of the Godson Industrialization Base of the Chinese Academy of Sciences, also recently visited Kaiding Science and Technology.
Recently, the “2011 China IC Design Company Achievement Award†was selected by 100,000 engineers for the “Electric Engineering Albumâ€. Hangzhou Kaiding Technology Co., Ltd. was selected as one of the “Top 30 Most Potential Chinese IC Design Companies†and was officially nominated for the “Top Ten Most Potential Chinese IC Design Companiesâ€.
As the first and the fourth IC design company in the world to master EPON core communication chip technology, it is an original technology enterprise that is dedicated to the development and design of optical access network chips. In 2010, the company took the lead in China to master EPON chip R&D technology with completely independent intellectual property rights.
The China Electric Power Research Institute is the maker of a series of standards for China's smart grid, and possesses the key technologies of the smart grid. It plays a crucial role in China's national smart grid projects. At the same time, the Communication and Power Consumption Branch of the Institute of Electrical Engineering and Technology is the national power grid chip industrial base and has undertaken the research and development and application of key chip technologies of the State Grid Corporation of China.
Since 2010, Kaiding Science and Technology and China Electric Power Research Institute have jointly launched a major issue of China's smart grid "EPON chip applied to distribution automation", participated in the State Grid Corporation of Standard "Ethernet-based passive optical network ( EPON)'s revision and a series of cooperation.
In January 2011, Kaiding Technology and the China Electric Power Research Institute of Communications and Power Technology Branch formally signed a contract. The two parties will formulate a power communication environment based on the relevant technical requirements of the State Grid Corporation's power consumption information collection system and distribution network automation system. Strong protection, high security, low power consumption, small size chip complete solution.
'Kaiding Technology has mastered a variety of integrated circuit design core technologies and has extensive IC product design and development experience. The responsible person of the China Electric Power Research Institute commented.
It is understood that the construction of the smart grid will be implemented in three phases: the first phase will be 2009-2010, mainly research and pilot; the second phase will be 2011-2015 and will be implemented on a large scale; the third phase will be 2016 - In 2020, the overall improvement and improvement will be achieved.
From the progress of the cooperation between Kaiding Science and Technology and the Institute of Electric Power, we can see that Kaiding Science and Technology, as it is the first of its kind in the country, has not only caught up with the 'first phase' in time. It has also entered the 'second stage' substantively. Li Yue, director of Kaiding Technology Products, said this.
It is understood that by 2020, the smart grid construction will achieve at least 4 trillion yuan in investment, among which the demand for communication chips will reach tens of billions of yuan.
In July 2010, Liu Zhenya, general manager of the State Grid Corporation of China, proposed the 'four network convergence' strategy at the 'Smart Grid International Forum' and join the existing three networks (telecommunications network, computer network and cable television network). The horn of the power grid and power system entering the communications industry officially blew.
From the point of view of four-network convergence, the status of communications technology in smart grid construction will be further enhanced, which means that the market share of communications chips will also be greatly expanded! Li Yue, Director of Kaiding Technology, said.
Li Yue believes that China's IC design has a short history and a weak foundation, as seen from an industrial perspective. The squeezing of foreign giants, the influence of self-owned brands, and the inertia of the market and users' reliance on imported chips have challenged the industry's next-step development. However, the introduction of a series of policies by various levels of government, and the increasing efforts of local governments in nurturing new industries and promoting changes in economic growth patterns, provide a more favorable policy environment for the IC design industry.
It is reported that in 2010 China's IC design industry was approximately US$5.5 billion, an increase of 34.8% year-on-year, exceeding the growth rate of 29.8% in the Chinese IC industry. It is expected that by 2013, the IC design industry will exceed US$11.2 billion. Among them, the independent intellectual property rights in the field of large-scale integrated circuits are relatively weak. Therefore, Kaiding's EPON core chips can be widely used in large-scale ICs such as smart grids, triple-play networks, optical network cities, wireless cities, and safe cities. Intellectual property technology has a very broad prospect.
At present, Kaiding Technology has been listed in Hangzhou's Eagle Project and is recognized as a high-tech enterprise in Hangzhou. In view of the characteristics of large input and long cycle of IC design, related departments and Hangzhou Science and Technology Bank successively provided financial support for Kaiding Science and Technology in various ways. The world-famous integrated circuit companies TSMC, UMC and Kawasaki visited the company on several occasions and became important partners for Kaiding Technology. Qian Yuebao, the deputy chairman of the National People's Congress and the chairman of the Godson Industrialization Base of the Chinese Academy of Sciences, also recently visited Kaiding Science and Technology.
Recently, the “2011 China IC Design Company Achievement Award†was selected by 100,000 engineers for the “Electric Engineering Albumâ€. Hangzhou Kaiding Technology Co., Ltd. was selected as one of the “Top 30 Most Potential Chinese IC Design Companies†and was officially nominated for the “Top Ten Most Potential Chinese IC Design Companiesâ€.
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