China's Tsinghua Unisplendour Group's Spreadtrum Communications announced on the 9th that it has signed a partnership with German semiconductor manufacturer Dialog, and the two sides have established a strategic partnership to jointly develop the LTE chip platform. Through the agreement, Spreadtrum Communications is actively deploying highly integrated power management, AC/DC power conversion, solid state lighting (SSL) and Bluetooth low energy (BLE) technologies. Dialog will provide integrated mixed-signal power management technology for Spreadtrum's LTE chip platform.
It is understood that the first phase of the cooperation between the two parties, Dialog's newly designed SoC chip, SC2705 will be applied to Spreadcomtech's 14nm process LTE chip platform SC9861G-IA. The platform is based on Intel's 14nm process technology and built-in Intel Airmont processor architecture, which was officially released at the Mobile World Congress (MWC) in February 2017. Based on the cooperation of the platform, Subsidiary and Dialog will also launch more differentiated LTE products and solutions for mainstream smartphones and regional markets.
Li Liyou, Chairman and CEO of Spreadtrum Communications, said in a statement that the cooperation between the two parties will help Spreadtrum Communications to provide differentiated products and services to meet the growing market demand. At the same time, through the cooperation with Dialog, Spreadtrum will also be able to provide customers with safer, more efficient and highly integrated mid- to high-end smartphone solutions to continuously enhance the user experience.
Jalal Bagherli, CEO of Dialog Semiconductor, also pointed out that Dialog's cooperation with Spreadtrum Communications provides an excellent opportunity for Dialog to apply its leading energy-saving technology to the latest LTE platform, which will also promote the continued development of Dialog. In the future, the cooperation with Spreadtrum Communications will provide a solid foundation for Dialog Semiconductor in the Chinese market. On the other hand, it also helps the two parties to cooperate to provide customers and consumers with a better and highly integrated LTE chip platform to meet the needs of the next generation of smartphones.
In 2016, Spreadtrum's global shipments of chips exceeded 600 million units. As emerging market consumers demand more and more intelligent terminal mobile device functions, the integrated power management technology provided by Dialog in LTE chip solutions will help customers to introduce new high-performance and new features. A generation of intelligent mobile terminal equipment.
According to Dialog, the newly designed SoC chip SC2705 incorporates three unique smartphone technologies. Includes haptic drivers capable of supporting LRA or ERM, white LED backlight display drivers, and auxiliary power for TFT-LCD or AMOLED display screens. In addition, the SC2705 includes an efficient charger. The SC2705 is available in a small WLCSP 4.135 mm x 5.335 mm package and will be available in the second quarter of 2017 and will be sold through Spreadtrum's sales pipeline.
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