Introduction and application of thermal conductive materials | ||
Material name | advantage | Disadvantage |
FR4 board | 1. Low cost and easy to make; 2. No need to consider the characteristics of the insulation layer | 1. Not applicable to the LED design of the heat sink with electrodes 2. Need to fill the hole with tin, increase the process 3. Need to thicken the copper foil layer to increase heat transfer efficiency |
Aluminum plate | 1. High general acceptance 2. The hardness is higher than FR4, and the thermal conductivity of the secondary end is better. 3. Electrical insulation is higher than FR4 | 1. The price is higher than FR4 2. It is less able to place other electronic components on the substrate 3. The thermal conductivity of the insulation layer is difficult to grasp |
Copper substrate | 1. Thermal conductivity is much higher than aluminum substrate 2. The specific heat value is lower, and the conduction temperature is easier to pull up. 3. Have the same advantages as aluminum substrates | 1. High cost, general design is not applicable 2. Has the same shortcomings of aluminum substrate |
Common gold plate | 1. The conduction center is unobstructed and the thermal conductivity is good. 2. Substrate application suitable for high power polycrystalline LED | 1. Not applicable to the LED design of the heat sink with electrodes 2. The cost is too high, not suitable for 1~5W power applications 3. High cost of mold opening |
Composite board | 1. The highest thermal conductivity coefficient, up to 500W/mK 2. High heat rejection, no heat left on the body | 1. It is difficult to manufacture and manufacture, and the processing procedure is difficult. 2. Poor material stability, doubts about frequent use 3. The cost is too high, it is difficult to commercialize mass production |
Introduction and application of secondary heat dissipation materials | ||
Aluminum- extruded ( pull-up) | 1. High thermal conductivity and fast heat transfer 2. The mold cost is low, and the length can be cut freely. 3. Processing is easy | 1. Hardness / steel is insufficient 2. The appearance is relatively unchanged, the aesthetic design is not easy 3. Fins heat dissipation, which is more likely to cause dust accumulation |
Aluminum - die casting | 1. The appearance can be arbitrarily changed to beautify the appearance 2. Can be mass produced quickly | 1. High cost of mold design and development 2. Low thermal conductivity, unfavorable thermal energy dissipation |
Coating material | 1. Can increase the heat dissipation capacity of the outer casing 2. Can slow the oxidation of the metal shell 3. Can beautify the appearance | Increase cost 2. Increase system thermal resistance 3. Increase processing technology |
Joint material introduction | ||
Thermal paste | 1. Low cost and easy to use 2. No specific processing technology | 1. It is not easy to apply evenly, and bubbles are easily formed. 2. The product has poor stability for a long time, is easy to cure, and forms a thermal barrier after curing. |
Silicone pad | 1. Long-term temperature resistance, temperature resistance 125~200°C 2. The higher the temperature, the better the thermal conductivity 3. With elastic characteristics, it is not easy to form bubbles | 1. High cost and increased product cost 2. High thickness, generally above 0.3mm |
Thermal phase change silicone pad | 1. Product advantages with general silicone pad 2. At high temperatures, the silica gel will soften to increase the caulking effect and increase the thermal conductivity. | 1. Not easy to process, and can not be used twice 2. Higher cost and increased product cost |
Edit: Sophy
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