China has developed a leading international LED lighting and cooling technology, and its thermal conductivity will be increased by more than 10 times.

Recently, from Chongqing Haihong Technology Co., Ltd. (hereinafter referred to as Haihong Technology), its exclusive research and development of "Lamp Bead Radiator Low Temperature Direct Welding Technology" (LTS) can completely solve the heat dissipation problem that has plagued the LED lighting field for many years. Through this technology, the luminous efficiency and service life of LED lamps can be greatly improved, and the thermal conductivity will be improved by more than 10 times. The breakthrough of this technology has attracted the attention of the industry, and Haihong Technology has become famous at the forefront of the LED industry.

With the increasing emphasis on environmental protection and the development of the LED industry, the application of large-scale promotion of high-power LEDs has become a trend of development in the future. However, for a long time, high-power LEDs have many advantages, but the requirements for heat dissipation technology are also very high. When the LED junction temperature reaches a certain height, the LED will soon produce light decay, resulting in a decrease in LED lifetime. Haihong Technology's "light bulb heat sink low-temperature welding technology" has brought about a major breakthrough, opening up the "brow" of the industry forward development.

It is understood that the technology is to bond a certain thickness of copper cover layer on the surface of the aluminum heat sink substrate by means of metallurgical bonding, and creatively realizes the low temperature direct welding of the lamp bead and the heat sink, completely solving the heat dissipation bottleneck of the system and enhancing the lamp at the same time. The heat of the bead heat source spreads laterally to the fins of the heat sink. The aluminum-copper coating is molecularly bonded and is not affected by thermal stress and electrochemical corrosion of dissimilar materials. In addition to the heat dissipation of the lamp bead, the thermal resistance of the interface material and the interface of the crimping method is eliminated. The heat exchange performance is not attenuated, thereby completely solving the problem of aging and thermal conductivity degradation of the thermal conductive silica gel. The technology completely solves the problem of light decay of LED lamps, improves the light efficiency and service life, greatly reduces the cost, and brings the possibility of large-scale promotion of LEDs.

"Low-beam direct soldering technology" (LTS) is a major innovation in the field of high-power LED lighting by Haihong R&D team, which makes it stand at the forefront of the world level in this technology field. For a long time, this private high-tech enterprise integrating technology research and development, product manufacturing and marketing has been quietly working in low-carbon technology fields such as green manufacturing, green energy, energy conservation and environmental protection, and has achieved many advanced scientific research. Results.

It is reported that Haihong Technology relies on the "LTS" technology. The high-efficiency heat-dissipating module integrating light source, light distribution, power supply and lamps will be launched before the National Day of 2010. At that time, the traditional lighting enterprises will be thoroughly removed into the field of LED light source manufacturing. Obstacles. Technical consultation phone: 0086-23-62763128

Lamp Beads - Radiator Straight Welding Technology

A copper coating layer of a certain thickness is bonded to the surface of the aluminum heat sink substrate by metallurgical bonding.

The lamp bead-heat sink is directly welded to eliminate the interface material and the interface thermal resistance of the crimping method.

The copper overlay enhances the heat transfer from the bead point heat source to the heat sink fins.

The aluminum-copper coating layer is molecularly bonded and is not affected by thermal stress and electrochemical corrosion of dissimilar materials.

The heat transfer performance is not attenuated. The problem of degraded thermal conductivity of thermal silica gel is completely solved.

Application effect

Thermal conductivity: up to 50 (W / mK), increased by more than 15 times.