Despite the large fluctuations in the international market, China's integrated circuit industry is still showing a momentum of growth this year. According to the data released by CCID Consulting, in the first half of 2011, China’s total integrated circuit production reached 40.56 billion pieces, which was a year-on-year increase of 25.2%; the industry’s total sales revenue was 79.326 billion yuan, a year-on-year increase of 19.1%. Although the chip manufacturing industry has been affected by domestic and international factors such as the Japan earthquake, the growth rate has declined. However, driven by the gradual release of new production capacity from Intel Dalian and Shanghai Huali, the sales revenue still maintains a relatively rapid growth, with a scale of 243.1. Billion yuan, a year-on-year increase of 16.2%.
For China's integrated circuit chip manufacturing industry, it not only has to bear the pressure of the industry itself to develop high-risk investment, but also needs to face the competition and pressure of the powerful semiconductor giants, and its development faces double challenges. On the one hand, it is weak in its own competitiveness. Domestic companies are small in scale, lack high-end technologies, and lack advanced technologies. On the other hand, IC design companies are relatively small in scale and dispersive in their power. They are not enough to support the further development and expansion of domestic chip manufacturing companies. IC manufacturing companies need to make efforts in three areas in the future.
First, seek to apply the "new point" of the market, catch up from technology to technological innovation, develop distinctive technologies, and seek differentiated competitive advantages. In the same application market, only by following Moore's Law, IC manufacturing industry can keep close to the international advanced level, but this development route, for the IC manufacturing industry, bears a considerable price. Therefore, we should seek differentiated development in characteristic fields. We can start with emerging market fields such as power semiconductors, optoelectronic semiconductors, and micro-mechanical manufacturing, develop technological innovations and feature technologies, and accumulate and enhance corporate strength.
Second, with local advantages, focus on service innovation. For China's IC manufacturing industry, it is located in the world's largest electronics industry manufacturing base and has a unique market advantage. The domestic IC manufacturing industry must make full use of its inherent local advantages, rely on its keen market sense, flexible sales operation mechanism, and rely on communication advantages, talent advantages, and policy advantages to more effectively and fully understand customer needs, carry out service innovation, and provide more Targeted service. At the same time, China’s IC manufacturing industry has to break the traditional concept of foundry foundry, transforming from a pure manufacturing business to a full-scale, one-stop platform service manufacturing model, and helping IC design companies, especially emerging IC design companies, to develop products quickly and in a timely manner. Push the market to achieve a win-win situation for customers and themselves.
Third, form a strategic cooperative relationship with each link of the industry chain to achieve common growth. The development of the semiconductor industry today requires the formation of a new type of cooperation. Domestic manufacturing companies should work together with design companies, packaging and testing companies, IP/design service providers, solution providers, and terminal application providers to form strategic partnerships to realize the industrial chain. The seamless cooperation of the links creates an integrated effect and achieves a win-win situation for all parties.
For China's integrated circuit chip manufacturing industry, it not only has to bear the pressure of the industry itself to develop high-risk investment, but also needs to face the competition and pressure of the powerful semiconductor giants, and its development faces double challenges. On the one hand, it is weak in its own competitiveness. Domestic companies are small in scale, lack high-end technologies, and lack advanced technologies. On the other hand, IC design companies are relatively small in scale and dispersive in their power. They are not enough to support the further development and expansion of domestic chip manufacturing companies. IC manufacturing companies need to make efforts in three areas in the future.
First, seek to apply the "new point" of the market, catch up from technology to technological innovation, develop distinctive technologies, and seek differentiated competitive advantages. In the same application market, only by following Moore's Law, IC manufacturing industry can keep close to the international advanced level, but this development route, for the IC manufacturing industry, bears a considerable price. Therefore, we should seek differentiated development in characteristic fields. We can start with emerging market fields such as power semiconductors, optoelectronic semiconductors, and micro-mechanical manufacturing, develop technological innovations and feature technologies, and accumulate and enhance corporate strength.
Second, with local advantages, focus on service innovation. For China's IC manufacturing industry, it is located in the world's largest electronics industry manufacturing base and has a unique market advantage. The domestic IC manufacturing industry must make full use of its inherent local advantages, rely on its keen market sense, flexible sales operation mechanism, and rely on communication advantages, talent advantages, and policy advantages to more effectively and fully understand customer needs, carry out service innovation, and provide more Targeted service. At the same time, China’s IC manufacturing industry has to break the traditional concept of foundry foundry, transforming from a pure manufacturing business to a full-scale, one-stop platform service manufacturing model, and helping IC design companies, especially emerging IC design companies, to develop products quickly and in a timely manner. Push the market to achieve a win-win situation for customers and themselves.
Third, form a strategic cooperative relationship with each link of the industry chain to achieve common growth. The development of the semiconductor industry today requires the formation of a new type of cooperation. Domestic manufacturing companies should work together with design companies, packaging and testing companies, IP/design service providers, solution providers, and terminal application providers to form strategic partnerships to realize the industrial chain. The seamless cooperation of the links creates an integrated effect and achieves a win-win situation for all parties.
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