During the “Eleventh Five-Year Plan†period, the packaging industry, which accounts for half of the output value of the integrated circuit industry in China, has formed an integrated supporting capacity. Its technical level is close to the international advanced level, and it is initially capable of achieving independent innovation and development. The reporter learned from the interview that it is particularly gratifying that domestic companies have achieved major key technologies in key packaging and testing equipment and materials application engineering projects, which has laid a solid foundation for China to seize the highland of IC packaging and testing industry in the future. basis.
A series of achievements are encouraging: The “Advanced Packaging Process R&D†project undertaken by backbone companies such as Jiangsu Changjiang Electronics Technology Co., Ltd. and Nantong Fujitsu Microelectronics Co., Ltd. has entered the mass production stage, and has successfully obtained continuous growth of high-end customers at home and abroad. Orders, new sales of more than 800 million yuan, greatly enhance the competitiveness of China's packaging industry, Changjiang Electronics Technology for the first time into the top eight international packaging industry. At the same time, major progress was made in the “Packaging Equipment and Materials Application Project†led by these two leading companies. The 23 types of packaging and testing equipment and 8 material products for special R&D completed the evaluation and verification and began to realize sales...
The person in charge of the Science and Technology Department of Jiangsu Province stated that integrated circuit products are the most basic and core strategic material of modern high technology, and are the strategic commanding heights for the upgrading of traditional industries and the development of high-tech industries. However, the equipment, materials, and manufacturing processes of the integrated circuit industry in China rely on the introduction and the foundation is very weak. As China's 16 major scientific and technological major projects, the implementation of “very large-scale integrated circuit manufacturing equipment and complete sets of processes†is to change China's long-term lagging behind in integrated circuit equipment and subject to human problems, focusing on breakthroughs in integrated circuit core manufacturing equipment and key integrated circuits. Manufacturing process technology.
It is understood that the packaging and testing process is a relatively mature link in China's integrated circuit industry chain. Its output value once occupied 70% of the total output value of China's integrated circuit industry. In recent years, due to the rapid development of China's integrated circuit design and chip manufacturing industry, the proportion of the industry has declined, but it still occupies half of China's integrated circuit industry.
Therefore, the "key sealing and testing equipment and materials application engineering project" is an important support for integrated circuit projects. Integrated circuit equipment and materials need to be verified in large companies before being used in production lines. In the “Key Containment and Testing Equipment and Materials Application Engineering Projectâ€, Changjiang Electronics Technology, a leading company in the packaging and testing industry, played the role of a verifier.
According to Yan Qiuyue, project leader of Jiangsu Changjiang Electronics Technology Group, during the inspection of the site of the “Key Packaging and Metering Equipment and Materials Application Engineering Project†phase in mid-July last year, the applied engineering project had applied for 50 patents; 12 patents were granted . All 16 equipment development units have completed the development of the alpha machine, of which 20 machines have been sent to the verification unit for beta testing, and all nine of the eight materials research and development units have completed the process verification sample delivery. Among them, the materials of 6 topics have passed the process verification and are undergoing reliability verification.
While individual companies continue to make achievements, China’s integrated circuit industry is also trying to quickly achieve breakthroughs through the joint development of the “Big Troopsâ€. As the first technological innovation alliance of 16 major scientific and technological special projects, the IC Packaging and Testing Industry Chain Technical Innovation Alliance was established in December 2009. The role of alliance innovation is reflected in the reduction of R&D costs of individual companies and the sharing of R&D risks; resources complement each other to complete innovation.
Insiders are very optimistic about the role of the alliance. They believe that the establishment of the alliance will be beneficial to China's integrated circuit packaging industry, test industry gathering and integration of innovation resources, will help speed up the development of the core industry and key products of the industry, application and industrialization of the industry, and facilitate cooperation in the production and research and technological achievements. The innovation activities such as scientific and technological exchanges at home and abroad have effectively promoted the improvement of the core competitiveness of the integrated circuit packaging and testing industry in China.
"The '12th Five-Year Plan' is an important period for the country to adjust its economic structure and develop new strategic industries, and it is also an important stage for Changjiang Electronics' innovation, transformation and development." Wang Xinchao, chairman of Jiangsu Changjiang Electronics Technology Co., expressed that we are looking forward to international advanced sealing testing. We have made breakthroughs in technology and entered the world's advanced packaging industry to realize the company's technological transformation and upgrading. Specifically, there are two goals: First, the scale of operations enters the top five in the world's packaging and testing industry, and strives for the top three; second, there are two or three innovative packaging technologies that can become international mainstream packaging technologies.
Wang Xinchao’s goal is a microcosm of the future goals of IC packaging and testing companies in China. With the continuous progress of the "Key Containment and Testing Equipment and Materials Application Engineering Project", our country's voice in the field of international integrated circuits will surely become louder.
A series of achievements are encouraging: The “Advanced Packaging Process R&D†project undertaken by backbone companies such as Jiangsu Changjiang Electronics Technology Co., Ltd. and Nantong Fujitsu Microelectronics Co., Ltd. has entered the mass production stage, and has successfully obtained continuous growth of high-end customers at home and abroad. Orders, new sales of more than 800 million yuan, greatly enhance the competitiveness of China's packaging industry, Changjiang Electronics Technology for the first time into the top eight international packaging industry. At the same time, major progress was made in the “Packaging Equipment and Materials Application Project†led by these two leading companies. The 23 types of packaging and testing equipment and 8 material products for special R&D completed the evaluation and verification and began to realize sales...
The person in charge of the Science and Technology Department of Jiangsu Province stated that integrated circuit products are the most basic and core strategic material of modern high technology, and are the strategic commanding heights for the upgrading of traditional industries and the development of high-tech industries. However, the equipment, materials, and manufacturing processes of the integrated circuit industry in China rely on the introduction and the foundation is very weak. As China's 16 major scientific and technological major projects, the implementation of “very large-scale integrated circuit manufacturing equipment and complete sets of processes†is to change China's long-term lagging behind in integrated circuit equipment and subject to human problems, focusing on breakthroughs in integrated circuit core manufacturing equipment and key integrated circuits. Manufacturing process technology.
It is understood that the packaging and testing process is a relatively mature link in China's integrated circuit industry chain. Its output value once occupied 70% of the total output value of China's integrated circuit industry. In recent years, due to the rapid development of China's integrated circuit design and chip manufacturing industry, the proportion of the industry has declined, but it still occupies half of China's integrated circuit industry.
Therefore, the "key sealing and testing equipment and materials application engineering project" is an important support for integrated circuit projects. Integrated circuit equipment and materials need to be verified in large companies before being used in production lines. In the “Key Containment and Testing Equipment and Materials Application Engineering Projectâ€, Changjiang Electronics Technology, a leading company in the packaging and testing industry, played the role of a verifier.
According to Yan Qiuyue, project leader of Jiangsu Changjiang Electronics Technology Group, during the inspection of the site of the “Key Packaging and Metering Equipment and Materials Application Engineering Project†phase in mid-July last year, the applied engineering project had applied for 50 patents; 12 patents were granted . All 16 equipment development units have completed the development of the alpha machine, of which 20 machines have been sent to the verification unit for beta testing, and all nine of the eight materials research and development units have completed the process verification sample delivery. Among them, the materials of 6 topics have passed the process verification and are undergoing reliability verification.
While individual companies continue to make achievements, China’s integrated circuit industry is also trying to quickly achieve breakthroughs through the joint development of the “Big Troopsâ€. As the first technological innovation alliance of 16 major scientific and technological special projects, the IC Packaging and Testing Industry Chain Technical Innovation Alliance was established in December 2009. The role of alliance innovation is reflected in the reduction of R&D costs of individual companies and the sharing of R&D risks; resources complement each other to complete innovation.
Insiders are very optimistic about the role of the alliance. They believe that the establishment of the alliance will be beneficial to China's integrated circuit packaging industry, test industry gathering and integration of innovation resources, will help speed up the development of the core industry and key products of the industry, application and industrialization of the industry, and facilitate cooperation in the production and research and technological achievements. The innovation activities such as scientific and technological exchanges at home and abroad have effectively promoted the improvement of the core competitiveness of the integrated circuit packaging and testing industry in China.
"The '12th Five-Year Plan' is an important period for the country to adjust its economic structure and develop new strategic industries, and it is also an important stage for Changjiang Electronics' innovation, transformation and development." Wang Xinchao, chairman of Jiangsu Changjiang Electronics Technology Co., expressed that we are looking forward to international advanced sealing testing. We have made breakthroughs in technology and entered the world's advanced packaging industry to realize the company's technological transformation and upgrading. Specifically, there are two goals: First, the scale of operations enters the top five in the world's packaging and testing industry, and strives for the top three; second, there are two or three innovative packaging technologies that can become international mainstream packaging technologies.
Wang Xinchao’s goal is a microcosm of the future goals of IC packaging and testing companies in China. With the continuous progress of the "Key Containment and Testing Equipment and Materials Application Engineering Project", our country's voice in the field of international integrated circuits will surely become louder.