The high price of LED products is an obstacle to popularization. The price factor determines the cost performance. The advantages and prices of lamps and lanterns can be accepted by the public, and it is one of the important factors affecting LED lamps to replace traditional lamps.
LED chips use larger-size wafer fabrication processes as their processes and quantities increase, and will continue to reduce costs. In recent years, the annual speed has been reduced by 20%. In the LED chip price factor, the improvement of light efficiency is also included in the price reduction. At the same price, a better product was purchased. The proportion of LED chips accounting for 15% is still very reasonable and will continue to be maintained at this level in the future.
LED packaging costs account for a considerable proportion of the price, probably at 50%, we must choose a more appropriate package structure. Cree, Lumileds, OSRAM's existing packaging does not meet the needs of the luminaire design, and the design cost will remain high. Bold innovative design is the way out for product design. Most of us still use the tactics of plagiarism for packaging structures of large companies, too little innovation, and lack of confidence in our own innovation. COB is the mainstream way of future luminaire design. According to luminaire optics, COB encapsulation is required, while the cost of secondary optical design is reduced. The packaging cost is more reasonable than 20-30% of the total cost of lighting.
The actual LED chip cost is only 15%. Other costs mainly come from packaging, heat dissipation, structure cost, and power supply. From the perspective of cost components, reducing the cost of lamps and lanterns is at the manufacturing stage, and simply requesting the reduction of LED chips is not much effective. The manufacture of lamps and lanterns requires overall reasonable prices, reasonable planning, and comprehensive simplicity that requires a certain part of the cheaper role, but the lighting we design the overall structure of the economy, is the most important optimization.
The design now accounts for about 20% of the cost of the luminaire, which is somewhat high. With technical development power is about 5-10% the most reasonable. The actual heat dissipation design is very simple, to live in two directions: First, the shorter the better the path of the LED chip and external heat sink components, the shorter the better your thermal design; Second, the heat dissipation resistance is to have enough heat dissipation At the same time, there must be enough 'cooling roads' to the path. This part of the cost is mainly in the structure, not much for cooling costs. The cost of heat dissipation must be maintained at 20%. China's hard-working people have always been pricing very low, 20% of the cost is considered reasonable, and the biggest problem is how to be more innovative and design more reasonable. The structural design is probably the weakest link in the luminaire, which is the weakest link in the LED luminaire, and it lags behind the development of LED luminaires. The quality needs to be improved.
LED chips use larger-size wafer fabrication processes as their processes and quantities increase, and will continue to reduce costs. In recent years, the annual speed has been reduced by 20%. In the LED chip price factor, the improvement of light efficiency is also included in the price reduction. At the same price, a better product was purchased. The proportion of LED chips accounting for 15% is still very reasonable and will continue to be maintained at this level in the future.
LED packaging costs account for a considerable proportion of the price, probably at 50%, we must choose a more appropriate package structure. Cree, Lumileds, OSRAM's existing packaging does not meet the needs of the luminaire design, and the design cost will remain high. Bold innovative design is the way out for product design. Most of us still use the tactics of plagiarism for packaging structures of large companies, too little innovation, and lack of confidence in our own innovation. COB is the mainstream way of future luminaire design. According to luminaire optics, COB encapsulation is required, while the cost of secondary optical design is reduced. The packaging cost is more reasonable than 20-30% of the total cost of lighting.
The actual LED chip cost is only 15%. Other costs mainly come from packaging, heat dissipation, structure cost, and power supply. From the perspective of cost components, reducing the cost of lamps and lanterns is at the manufacturing stage, and simply requesting the reduction of LED chips is not much effective. The manufacture of lamps and lanterns requires overall reasonable prices, reasonable planning, and comprehensive simplicity that requires a certain part of the cheaper role, but the lighting we design the overall structure of the economy, is the most important optimization.
The design now accounts for about 20% of the cost of the luminaire, which is somewhat high. With technical development power is about 5-10% the most reasonable. The actual heat dissipation design is very simple, to live in two directions: First, the shorter the better the path of the LED chip and external heat sink components, the shorter the better your thermal design; Second, the heat dissipation resistance is to have enough heat dissipation At the same time, there must be enough 'cooling roads' to the path. This part of the cost is mainly in the structure, not much for cooling costs. The cost of heat dissipation must be maintained at 20%. China's hard-working people have always been pricing very low, 20% of the cost is considered reasonable, and the biggest problem is how to be more innovative and design more reasonable. The structural design is probably the weakest link in the luminaire, which is the weakest link in the LED luminaire, and it lags behind the development of LED luminaires. The quality needs to be improved.